Thermal Management

MaxQ Technology has extensive thermal management expertise. Whether your problem is a simple air cooled heatsink for a power supply or a complex high performance dual-sided liquid cooled coldplate for a Hybrid Electric Vehicle, MaxQ Technology has the necessary tools and technology to provide an exceptional solution.

Combining theoretical knowledge with computational fluid dynamic tools allows MaxQ Technology to quickly evaluate design concepts, run detailed analyses and arrive at viable options. Our engineers are ready to think through the optimal solution with you.

In addition to comprehensive design and simulation work, MaxQ Technology has full prototyping capabilities. We pride ourselves on providing initial prototype units in the shortest time possible. Be sure to review our standard and custom liquid cooled cold plates as examples of our capabilities.

Thermal Management Capabilities

  • Power electronic packaging and integration from module, cooling system, up to system drive components
  • Thermal, electro-thermal, and thermo-mechanical simulation
  • Power circuit electrical, inductance and electro-thermo simulation
  • Rapid prototyping of liquid-cooled cold plates
  • Module power loss measurements
  • Liquid-cooled cold plate thermal performance
  • Liquid-cooled cold plate pressure loss measurements

Electronic Packaging

The principals at MaxQ Technology have a long history of developing electronic package solutions for a variety of applications. This includes novel and effective designs for:

Power IGBT and MOSFET modules: including single, dual or six-pack configurations. Our design portfolio includes 0.5KW to 200KW power converters, an electronic power steering module, advanced power device cooling structures and use of composite materials such as AlSiC, Cu-C and Al-Diamond.

Sensor modules: including pressure, accelerometer and airflow. Familiarity with Micro Mechanical Systems (MEMS) allows our team to handle difficult design problems related to MEMS products.

Microelectronics: including QFN, Chip Scale Packaging (CSP), and other surface mount products. Considerable expertise in flip-chip packaging positions MaxQ Technology well for highly integrated and cost sensitive designs intended for high volume production.

Complete system level designs: including motor drives, energy storage and other power conversion units. Our engineers have substantial practical knowledge in mechanical and system integration.

Packaging Capabilities

  • Liquid-cooled cold plate design
  • Power electronic packaging and integration from module, cooling system, up to system drive components
  • Chip layout design using MOSFETs, IGBTs, Rectifiers and Free-wheeling Diodes
  • Substrate layout design using Direct Bond Copper (DBC) substrates, Insulated Metal Substrates (IMS) and FR4 boards
  • QFN, Chip Scale Packaging (CSP) and Flip-chip Packaging

Consulting

MaxQ Technology offers a host of services for OEMs, Systems Integrators and end-users in several areas.

Thermal Management Design and Modeling

Air-cooled heatsinks or liquid cooled cold plates? MaxQ Technology has years of experience in modeling both types of active cooling schemes for power electronics. Whether your application requires air-cooled heatsinks or liquid cooled cold plates, MaxQ Technology can develop the right solution for you.

Electronic Packaging

From single-chip discrete packaging up to multi-die IGBT power modules, MaxQ Technology can help you design the right package to fit your needs. We use the latest techniques and software to achieve your desired results. MaxQ Technology's design iteration involves thermo-mechanical modeling, thermo-electrical modeling, electrical inductance modeling and electrical circuit analysis.

Engineering Tools

  • SolidWorks - 3D Solid Modeling Software
  • FloWorks - Computational Fluid Dynamics (CFD) simulation software
  • 3G Author Finite Element Analysis - thermal and mechanical simulation software
  • Infolytica MagNet - 3D Field Solver
  • MathCAD - engineering and scientific software
  • Eagle - PCB Layout tool
  • LabView - automated test system software development system